Hanmi Semiconductor has doubled sales volume of its MSVP (Most Similar Value Package) equipment and now holds the top share of the global MSVP market, according to a report from finance.biggo.com.

The milestone matters for one specific reason: the company achieved it after breaking its dependence on Japanese equipment suppliers. Until now, critical elements of Hanmi's toolchain reportedly relied on components sourced from Japan — a vulnerability that has haunted Korean semiconductor equipment makers since Japan's 2019 export controls on key materials exposed structural dependencies across the Korean chip supply chain.

What is Hanmi's MSVP position?

MSVP packaging tools serve memory and logic customers deploying advanced packaging flows. Hanmi, headquartered in Seoul, supplies major chipmakers with bonders and related assembly equipment used in high-bandwidth memory (HBM) production chains.

Per the report:

• Hanmi's MSVP sales volume has doubled.
• The company now claims the number-one share of the global MSVP equipment market.
• It reached this position after ending its dependence on Japanese equipment suppliers.

The report did not disclose absolute revenue figures or unit shipments, so the doubling refers to volume growth rather than a confirmed won-denominated sales total.

Why does the Japanese dependency break matter?

Korea's semiconductor equipment industry has spent years localizing supply chains after Tokyo tightened exports of photoresists, hydrogen fluoride, and fluorinated polyimide to South Korea in July 2019. For toolmakers like Hanmi, the risk was similar: a single Japanese supplier bottleneck could halt shipments to customers such as SK hynix and Samsung Electronics.

By qualifying domestic or non-Japanese alternatives for its MSVP production line, Hanmi reduces that chokepoint risk. The finance.biggo.com report frames the shift as a precondition for the market-share gain rather than a side effect — the company scaled output because it could, not merely because demand rose.

What does this change competitively?

Topping the MSVP segment places Hanmi ahead of the Japanese and international equipment vendors that previously dominated the niche. Advanced packaging has become the fastest-growing corner of the semiconductor equipment market as HBM demand for AI accelerators drives orders, and MSVP-class tools sit directly in that demand path.

A doubled sales volume also signals capacity headroom: Hanmi appears able to ship at scale without waiting on imported Japanese subcomponents, a position some rivals cannot yet claim.

The report carries no guidance on pricing or next-quarter shipments. If HBM capacity expansion continues at current rates, Hanmi's lead in MSVP tools should face its first real test in how quickly competitors close the localization gap.