Extra-Rugged, Cool-Running MOSFETs Drive Up Power Density

Semiconductors

AOS launches 600-V super-junction MOSFETs with top-side cooling

Alpha and Omega Semiconductor introduced 600-V, 37 mΩ and 60 mΩ super-junction MOSFETs in top-side-cooled GTPAK packages for high-power-density power designs.

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By Grace Kim

Alpha and Omega Semiconductor has introduced two 600-V super-junction MOSFETs with resistance ratings of 37 mΩ and 60 mΩ in top-side-cooled GTPAK packages for high-voltage power conversion. The AOGT037V60DE2 and AOGT060V60DE2 are the company's latest high-voltage devices. Both packages place the cooling interface on the top side.

What did AOS release?

Alpha and Omega Semiconductor, or AOS, said: “The MOSFETs have been optimized for use across a wide range of higher-voltage applications.” Named markets include servers, telecom rectifiers, solar inverters, motor drives and industrial systems. Those systems are all pursuing higher efficiency and increased power density, according to the company.

The company did not identify individual customers or completed design wins. Nor did it disclose pricing, shipment dates or expected revenue. Those commercial figures therefore remain unquantified. The 600-V family addresses server, telecom, solar and industrial markets, but the announcement does not map either model to specific named customer programs at launch.

How do the two devices differ?\n

Both models retain the 600-V rating and top-side-cooled GTPAK construction, giving designers two resistance choices within one packaging and voltage platform for high-voltage conversion work. The AOGT037V60DE2 carries a 37 mΩ resistance rating, while the AOGT060V60DE2 is rated at 60 mΩ. The lower number makes the AOGT037V60DE2 the lower-resistance member of the pair.

The 37 mΩ and 60 mΩ ratings are manufacturer-stated product specifications, not analyst estimates. No comparative efficiency data accompanied the launch. AOS attributed the packaging benefit to “allowing system designers to optimize thermal dissipation and reclaim PCB space for higher power density.” Top-side cooling places the thermal interface on the package's upper surface.

Which converter designs are targeted?

The company presents the pair as covering boost PFC, totem-pole PFC slow-leg operation, LLC resonance and several named industrial converter arrangements within high-voltage power conversion. AOS also listed phase-shifted full-bridge converters, cyclo-converters and switch-mode power supplies.

These are stated target topologies, not announced deployments at named customers. The breadth gives AOS a route into several power-conversion designs sharing a 600-V operating class. However, AOS did not provide topology-specific efficiency, output-power or thermal-resistance measurements. Product fit is therefore the stated commercial case, while measured gains remain undisclosed.

What does the electrical ruggedness establish?\n

AOS rates body-diode ruggedness at a di/dt of 1,500 A/µs. The company also claims superior avalanche capability, identified as UIS, and an extended short-circuit withstand time, or SCWT. AOS says the ruggedness features align with boost PFC, totem-pole PFC slow-leg operation and LLC resonant converters, although only one ruggedness metric received a numeric value.

The 1,500 A/µs value is the only numerical electrical-ruggedness figure in the announcement. AOS supplied no comparative UIS values, short-circuit duration or test conditions. The release therefore establishes a quantified body-diode specification but leaves the other ruggedness claims unbenchmarked. A design win would need to account for those other parameters, which the launch does not quantify.

What is the commercial significance?

The products target markets with an explicit push toward higher efficiency and increased power density. Top-side cooling is the common technical thread because it combines heat removal with PCB-space recovery. The package claim applies across both products. AOS did not assign either resistance rating to a specific named topology. No unit-volume data accompanied the launch.

The release also did not identify a manufacturing site, fabrication process or production capacity. Accordingly, it confirms a broadened 600-V portfolio, but not the scale of that expansion. Competitive effects will depend on design adoption and pricing, neither of which AOS disclosed. If AOS secures design wins across server, telecom, solar, motor-drive and industrial applications, the family could broaden its role in high-power-density converters, although volume and pricing remain undisclosed.

Original: aosmd.com

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Market editor covering people, launches and day-to-day practice in Semiconductors, chip manufacturing, hardware, AI compute at Chip Dispatch.

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