Northrop Grumman says U.S. semiconductor production will quadruple by 2030 under a domestic expansion effort aimed at strengthening defense chip supply chains.

The defense contractor's projection, reported by Defence Industry Europe, points to a fourfold increase in American chip manufacturing capacity over roughly the next five years. Northrop Grumman frames the expected ramp-up as a way to shore up the supply chains that feed U.S. defense programs, which depend on a broad base of legacy and advanced semiconductors.

The company's statement lands amid a sustained push to move more chip fabrication onto U.S. soil. Defense systems have become a central concern in that effort, because weapons platforms, sensors and communications equipment draw on components fabricated across a fragmented global supply chain. A quadrupling of domestic output would give defense primes like Northrop Grumman a deeper pool of U.S.-made parts to draw from.

Northrop Grumman itself is a major consumer of semiconductors, building products that span aircraft, space systems and missiles. The company's microelectronics needs cover everything from radiation-hardened components for satellites to microelectronics embedded in weapons and radar. A larger domestic manufacturing base would reduce its exposure to offshore supply disruptions.

The 2030 timeline tracks with the broader arc of U.S. fab construction now underway, as new capacity funded in recent years comes online toward the end of the decade. Northrop Grumman's projection, if realized, would mark a major shift in where chips for American defense hardware are made.

For now, the quadrupling figure stands as a projection tied to announced expansion plans rather than delivered capacity. Whether the ramp-up hits the 2030 mark will depend on how quickly new fabs reach full production and how defense supply chains absorb the added output.