Paras Defence Unit Taps BroadPak for Advanced Packaging Push in India

Paras Semiconductors, a subsidiary of Mumbai-listed Paras Defence & Space Technologies, will partner with San Jose-based BroadPak Corporation to build advanced semiconductor packaging capability in India. The announcement, dated November 6, 2026, names no investment value, location, capacity figure or commissioning schedule for the proposed facility.

The two companies plan an outsourced semiconductor assembly and test (OSAT) plant built around heterogeneous integration and 3D packaging. The technology scope covers 2.5D and 3D packaging, chiplet integration, hybrid bonding, wafer level and panel level fan-out packaging, co-packaged optics and semiconductor testing. Planned process capabilities include wafer level processing, through silicon vias, micro bumping, advanced interposers, redistribution layers and reliability testing.

Paras Semiconductors gains access to BroadPak's design, manufacturing and integration intellectual property, together with technology transfer and process knowledge for advanced packaging and chiplet integration. The partners also plan joint development of packaging platforms for artificial intelligence and high-performance computing, plus training programs for Indian engineers.

What does each partner bring?

BroadPak, founded in 2007, works on heterogeneous integration, multidie architectures, high-speed interconnects, thermal management and packaging, spanning architecture development, design, simulation, assembly, testing and production. Its founder and chief executive, Dr. Farhang Yazdani, has more than two decades of industry experience and invented 3DHI HiRise Packaging Technology; his work spans heterogeneous integration, chiplet architectures, silicon photonics and co-packaged optics.

For Paras Defence, the deal extends existing business in optics, optronics, defence electronics, electromagnetic pulse protection and heavy engineering. The company operates across two segments: Optics & Optronic Systems and Defence Engineering.

What did the executives say?

Munjal Sharad Shah, Managing Director of Paras Defence & Space Technologies, said: "Our entry into the semiconductor sector represents a strategic expansion into a technology domain that is increasingly critical to India's AI and data centres and industrial capabilities."

Santosh Kumar, Chief Executive Officer of Paras Semiconductors, framed the technical case: "The semiconductor industry's requirements are evolving beyond conventional chip manufacturing towards advanced integration of multiple dies, memory and processing components within a single package." He said the partners intend to build a platform addressing the performance, connectivity and thermal requirements of next-generation applications.

Dr. Yazdani said India's growing semiconductor ecosystem presents an opportunity to develop heterogeneous integration and system-level packaging capability, and that BroadPak will bring its engineering and manufacturing expertise to support that build-out.

How large is the market?

The advanced packaging market is projected to grow from more than US$40 billion in 2024 to over US$80 billion by 2030, according to Yole Group estimates presented at the 2026 IMAPS Device Packaging Conference. That projection is an analyst forecast, not a confirmed revenue figure. The demand signal comes from manufacturers adopting advanced packaging for AI accelerators, GPUs and high-bandwidth memory.

The announcement also cites NITI Aayog's 2026 semiconductor industry roadmap, which identifies 2.5D and 3D integration, chiplet assembly, fan-out packaging and system-in-package technologies as priority areas for domestic manufacturing development.

What remains undecided?

The proposed OSAT facility is intended to serve high-volume manufacturing across strategic electronics, optical and optronic systems, networking, data centers and computing. The companies have outlined technology transfer, engineering training and platform development, but the press announcement does not specify the site, capital outlay, wafer capacity or timeline.

The partnership signals that an Indian defence electronics group sees advanced packaging, not front-end fabrication, as its entry point into semiconductors. Whether the proposed facility reaches volume production will depend on investment commitments and customer demand that the announcement has yet to disclose.