UL Solutions Inc. (NYSE: ULS) launched a certification program on September 29, 2026 for liquid cooling subassemblies that cool powerful AI chips directly, targeting a component layer of AI data center infrastructure that has so far lacked a consistent, independent evaluation standard.

The program covers liquid-filled parts and subassemblies that move coolant through information and communication technology equipment: cold plates that absorb heat directly from chips, manifolds that route coolant to servers and racks, and quick disconnects that allow servicing without draining the entire cooling loop. UL Solutions evaluates these components under UL 4501, its Outline of Investigation for Safety, Performance and Interoperability of Liquid-Filled Components and Assemblies Used in Liquid Cooling Systems.

The evaluation scope is specific. It covers coolant compatibility, pressure and leak integrity, durability, liquid flow, interoperability, production controls and installation requirements. By certifying parts before they enter a complete cooling system, UL Solutions aims to catch problems earlier and cut the need for repeated system-level testing.

The commercial context is straightforward. AI accelerators and other high-performance chips generate heat densities that traditional air cooling — fans and chilled air — cannot reliably handle. With direct-to-chip liquid cooling, coolant flows through a cold plate attached to the chip, absorbing and carrying heat away much like water through a radiator. If that heat is not removed, equipment throttles, shuts down or fails.

The economics amplify the stakes. Global data center electricity use is expected to more than double between 2024 and 2030, according to the International Energy Agency, and cooling can account for up to 40% of a data center's energy use, per the U.S. Department of Energy. Liquid cooling improves heat control, but it introduces new failure modes: leaks, corrosion, contamination and components that do not work well together.

Interoperability is a particular pain point. Parts from different suppliers may physically fit but require different coolants, pressure levels or operating conditions. Industry observers, including McKinsey, have identified integration problems and limited standards as barriers to wider liquid cooling adoption — a gap the certification program is positioned to address.

"As AI data centers handle more powerful computing, they depend on even more advanced cooling systems to operate safely and reliably," said Jennifer Scanlon, president and CEO of UL Solutions. "Our certification helps IT equipment manufacturers demonstrate product performance and safety while giving data center operators greater confidence during integration."

For cooling component manufacturers, an independent UL Mark provides third-party backing for product claims before deployment. For data center operators, it offers a consistent way to assess critical cooling components ahead of purchase and integration decisions — replacing a fragmented qualification process with a standardized one.

"AI infrastructure must scale without sacrificing safety or reliability," said Milan Dotlich, vice president and general manager of Data Center Solutions at UL Solutions. "Independent evaluation of liquid cooling components can help organizations deploy advanced computing systems with greater confidence."

Beyond the core program, UL Solutions can evaluate additional data center cooling equipment under applicable UL Standards: coolant distribution units, self-contained liquid-filled systems, liquid-cooled busways, cables, connectors, power whips, gaskets, O-rings and hoses, with requirements depending on each product's design, function and intended use.

As rack power densities climb with each generation of AI accelerators, a recognized certification regime for the liquid cooling supply chain could become a purchasing prerequisite for hyperscale operators — and a competitive differentiator for component makers who certify first.