Kioxia Ships Liquid-Cooled CM9 SSDs for Hot-Rack AI Datacenters
Kioxia's PCIe Gen 5 CM9-DLC SSD adds cold-plate direct liquid cooling in E3.S, matching air-cooled performance in hot racks. Sampling now; OCP Summit debut October 2026.
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Kioxia has added direct liquid cooling to its PCIe Gen 5 CM9 datacenter SSD, allowing the drives to run inside hot rack chassis without thermal throttling. The new CM9-DLC products carry a cold-plate-compatible metal enclosure and retain full air-cooling support as a fallback. The enclosure touches the top or both sides of the device to transfer heat to the liquid loop.
The move targets AI infrastructure, where rack power density has outgrown conventional air cooling. Maulik Sompura, Senior Staff Director of Product Management in the SSD business unit at Kioxia America, framed the product as a response to that shift.
"The rise of AI infrastructure is driving a fundamental shift in data center design toward higher power densities and advanced cooling technologies," Sompura said. "The Kioxia CM9-DLC Series addresses these evolving requirements by combining industry-leading enterprise SSD performance with direct liquid cooling support in the E3.S form factor."
He added that the drives let customers "deploy denser, more energy-efficient AI systems while providing the performance, endurance, and capacity needed for data-intensive workloads, including emerging AI architectures that rely on large-scale memory and KV cache resources."
What stays the same and what changes?
Performance does not change. The liquid-cooled CM9 posts the same numbers as the air-cooled CM9. The value proposition is thermal headroom, not speed: builders can pack drives into hot rack chassis where air-cooled SSDs would throttle.
The mechanical burden shifts to system integrators. Kioxia says the drives "support cold-plate-enabled server designs" but offers no details on mounting, thermal contact surfaces, or specific cold-plate compatibility. Deployment requires the builder to match the host server's cold-plate and manifold system, integrate the coolant loop, and complete qualification.
Kioxia points system builders to the SFF-TA-1008 rev. 3.0a specification. That standard defines cooling-interface areas and mechanical keying, including enclosure modifications that establish flush contact between the drive housing and the external cold-plate manifold where the liquid coolant circulates.
How does this fit Kioxia's roadmap?
This is the second liquid-cooled SSD line from the company this year. Kioxia gave its CM10 series liquid-cooling support earlier in 2025, and the CM9-DLC extends the approach down a product tier. The pattern signals that direct liquid cooling has moved from a niche server requirement to a standard option across Kioxia's enterprise portfolio.
The CM9 Series is sampling to select customers now. Public exposure follows at the 2026 OCP Global Summit, scheduled for October 12–15 in San Jose, California. Kioxia has not disclosed pricing or volume availability dates.
Why liquid-cooled storage matters now
AI training and inference servers concentrate heat in ways that air cooling struggles to manage, and storage sitting in the same chassis inherits the problem. KV cache workloads tied to large language models add sustained read pressure that keeps drives near their thermal limits for long stretches. A drive that transfers heat to a liquid loop, rather than to chassis air, can hold rated performance inside a hot rack where the ambient temperature exceeds what air-cooled designs tolerate.
The catch is integration cost. Every deployment requires matching manifold hardware, coolant loop design, and a qualification cycle specific to the server platform. Kioxia has placed that work on the system builder rather than certifying specific cold-plate pairings.
If AI rack designs keep tightening thermal budgets, expect liquid-cooled SSDs to shift from optional variant to default configuration in Kioxia's enterprise lineup.
Original: members.snia.org
More from Grace Kim
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Market editor covering people, launches and day-to-day practice in Semiconductors, chip manufacturing, hardware, AI compute at Chip Dispatch.
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